MediaTek has announced its latest 8000-series chipset with the Dimensity 8300. The new SoC is based on TSMC’s second-generation 4nm process and comes as a direct successor to last year’s Dimensity 8200 offering performance upgrades across the board.
MediaTek Dimensity 8300
The Dimensity 8300 features 4 Arm Cortex-A715 high-performance cores clocked at up to 3.35 GHz along with 4 Arm Cortex-A510 efficiency units clocked at up to 2.2 GHz. All eight cores are based on the The Armv9 CPU architecture and MediaTek claim up to 20% faster CPU performance and 30% peak gains in power efficiency compared to the outgoing Dimensity 8200.
| Size 8300 | Size 8200 | Size 8100 | |
| Node | 4 nautical miles | 4 nautical miles | 5 nautical miles |
| CPU Prime | 1x Cortex-A715 at 3.35 GHz | 1x Cortex-A78 3.1GHz | – |
| Big CPU | 3x Cortex-A715 at 3.0GHz | 4x Cortex-A78 at 3.0GHz | 4x Cortex-A78 at 2.85 GHz |
| Low CPU | 4x Cortex-A510 at 2.2GHz | 4x Cortex-A55 at 2.0GHz | 4x Cortex-A55 at 2.0GHz |
| RAM | LPDDR5X (up to 8,533 Mbps) | LPDDR5 (up to 6,400 Mbps) | LPDDR5 (up to 6,400 Mbps) |
| Warehousing | UFS 4.0 with MCQs | UFS3.1 | UFS3.1 |
| GPU | Mali-G615 (60% faster than 8200) | Mali-G610 MC6 | Mali-G610 MC6 |
| Screen | FHD+ at 180 Hz, WQHD+ at 120 Hz | FHD+ at 168 Hz, WQHD+ at 120 Hz | FHD+ at 180 Hz, WQHD+ at 120 Hz |
| Camera (photo) | 320MP | 320MP | 200 MP |
| Camera (video) | 4K at 60 fps (HDR10+) | 4K at 60 fps (HDR10+) | 4K at 60 fps (HDR10+) |
| 5G | Downlink at 5.17 Gbps | Downlink at 4.7 Gbps | Downlink at 4.7 Gbps |
| Wifi | Wi-Fi 6E (2×2) | Wi-Fi 6E (2×2) | Wi-Fi 6E (2×2) |
| Bluetooth | 5.4 | 5.3 | 5.3 |
The new chip also boasts an Arm Mali-G615 MC6 GPU that offers up to a 60% performance increase and 55% improved power efficiency at peak speeds compared to its predecessor. MediaTek also claims that cold launch of apps is up to 17% faster and launch of apps from standby up to 47% faster with the new chip. The new chip also supports quad-channel LPDDR5X RAM at speeds of 8,533 Mbps and UFS 4.0 storage with Multi-Circular Queue (MCQ) support.
The 780 APU inside the Dimensity 8300 makes it the first chip in its class to support generative AI with stable diffusion and support for LLM with up to 10 billion parameters. The Imagiq 980 ISP supports camera sensors up to 320 MP and 4K video recording at 60 fps.
Dimension Breakdown 8300
The Dimensity 8300 features an integrated 5G modem with support for dual-mode 5G and downlinks up to 5.17 Gbps on sub-6GHz networks. The chip also features Wi-Fi 6E and Bluetooth 5.4 connectivity.
Xiaomi has already confirmed that its Redmi K70E will debut the Dimensity 8300 later this month.
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