Today Samsung announced its future plans in the chip manufacturing industry. Dr. Si-young Choi, president of the company’s Foundry Business, delved into Samsung’s roadmap for chip manufacturing.
According to Samsung’s plans, we should expect 2nm chips to roll out of factories in 2025, while 1.4nm chips will roll out in 2027. Around that time, Samsung plans to expand its foundry portfolio by 50% and will include non-mobile chips such as high-performance computing chips or those used in the automotive industry. It effectively means Samsung will triple its production of advanced nodes.
Samsung will be able to do this by switching to an entirely new strategy called Shell-First. Essentially it means that future fabulous expansions will first focus on building so-called clean rooms. This is the building itself without the equipment needed to make the chips. This would allow the tech giant to be more flexible with its future production and quickly repurpose production lines. The facility piloting this approach is under construction in Taylor, Texas, for $ 17 billion.
Samsung also gave us an update on the X-Cube chip packaging process which was first introduced in 2020. It allows for thinner stacking of more chips. The first 3D packaging X-Cube hardware with micro-bump interconnect is slated for 2024, and in 2026 the design will become bump-free. This process also allows for the design of custom chips tailored to the specific needs of the customer.
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