Infinix has developed an improved vapor chamber cooling system which it calls the “3D Vapor Cloud Chamber” (3D VCC). Compared to conventional models, it reduces the chipset temperature by 3 ° C, according to the company.
The way it does this is to improve the contact between the chipset and the vapor chamber itself. The phone’s VCs are typically flat, which requires the use of thermal paste (or a similar material) to pair the chipset and VCs.
The 3D VCC design has a “bump” that leaves only minimal space between the camera and the chipset. The bump has an added benefit: it increases the internal volume of the VC, which means it can hold more water.
This design was promising but introduced some challenges. Since vapor chambers are purely passive elements, they rely on a wick material to transfer the condensed water from the cold part of the phone to the hot areas where it can evaporate again (and take the heat with it). The impact disrupted normal flow, so Infinix’s R&D team had to figure out how to restore it. The solution was to use a sophisticated hair structure and an advanced welding technique.
Now the company is looking for ways to further improve this design. He wants to make the 3D VCCs thinner and give them more bumps, so that they can effectively cool other heat-generating components as well. The company is also studying new materials and integrating 3D VCC with the phone’s midframe.
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