The Tensor G3 chip, which is reportedly made by Samsung and is based on its Exynos 2400, could be the first Samsung Foundry chip to incorporate Fan-out wafer-level packaging (FO-WLP). This enhanced wafer-level packaging will, in theory, allow for better efficiency, better graphics performance, and greater power savings.
FO-WLP has been used by Qualcomm and MediaTek, but this is supposedly the first time Samsung Foundry has used the technology.
The 4nm Tensor G3 will be integrated into the Pixel 8 and Pixel 8 Pro and will have a 9-core CPU: one Cortex-X3 prime core, four Cortex-A715 and four Cortex-A510. For graphics, it will use the 10-core Arm Immortalis G715 GPU, compared to the 7-core G710.
The Pixel 8 series will arrive on October 4.
The Tensor G3 is the first of Samsung Foundry’s smartphone chips to incorporate FO-WLP packaging, which is expected to reduce heat generation and increase the power efficiency of the Tensor G3.
— Revegnus (@Tech_Reve) September 11, 2023
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