Smartphone companies often introduce their own chips to gain more control over the processing and computational models of their devices. Oppo already has its MariSilicon X NPU and a connectivity chip called MariSilicon Y, but it still lacks a real SoC – system-on-a-chip.
According to a Mediatek executive, speaking at a foreign investment forum in Hsinchu, Taiwan, Oppo wants to have a real chipset to maintain its competitive edge. An insider revealed that the Guangdong manufacturer has already registered its chip and will arrive on the market in 2024.
Taping out is a term in electronic design which means that the design process for integrated circuits is already completed and the product is ready to be sent to manufacturing.
The conference taking place in Hsinchu is no coincidence: the city in northwest Taiwan is where TSMC has set up its headquarters, and we may or may not see the manufacturer partnering with Oppo.
Earlier reports have already revealed that Oppo has invested more than CNY 10 billion (about $1.4 billion) in setting up IC design centers across China, including Beijing, Shenzhen and Shanghai.
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